Corning Showcases High-Performance Microwave Interconnect Solutions At IMS 2023

Corning Incorporated (NYSE: GLW) will showcase two push-on, high performance, microwave interconnect solutions – the G3PO™ and G4PO™ at the 2023 International Microwave Symposium, June 12-16 in San Diego, California. With our well-known quality, Corning’s innovations help to solve our customers’ toughest connectivity challenges through solutions that are easily integrated and customized for constrained environments.

First developed for demanding military applications, The G3PO™ and G4PO™ series build on our pioneering GPO series, which was the industry’s first 'push on' sub-miniature high frequency connector system. This floating interconnect system enables the system designer to work with looser alignment tolerances, helping to ease manufacturing intensity by lowering assembly time and complexity, leading to improved flexibility. Since then, our solutions have been increasingly seen as a high frequency interconnect solution for military, satellite, wireless and telecommunications applications.

“Corning’s microwave connectivity solutions have a long legacy of operating reliably in some of the world’s harshest environments,” said Dave Meis, director for Corning’s Aerospace & Defense business. “As the pace of technological change accelerates, the demand for more connectors in smaller and smaller spaces has intensified. Corning is integral to the progress that will help our customers enable the next generation of advanced systems.”

In Booth 2335 at the conference, Corning’s experts will showcase our latest innovations, including:

• G3PO™ Interconnect Series: A high-frequency (65 GHz & 100 GHz) connectivity solution for telecommunications, radar systems, shipboard, airborne, ground-based, missile programs, cryogenic, and non-magnetic applications. Our G3PO™ interconnect series offers a blind mate interconnect that has a center-to-center spacing of 0.085 in and weighs just .016g. This series is designed to accommodate both radial and axial misalignment with negligible voltage standing wave radio (VSWR) change to perform in high-stress environments. Within this series, we also offer adapters available to SMA, 1.85 mm, and 2.4 mm.
   
• G4PO™ Interconnect Series: Our latest innovation, this ultra-high-density connectivity solution enables high frequency (60 GHz) connections even in constrained environments that lack open access. With center-to-center spacing of 0.070 in, board-to-board spacing of 0.090 in, and a weight of .005g, this series is 50% smaller than GPPO^® and 18% smaller than G3PO™. Within this series, we also offer adapters available to SMA, 1.85 mm, and 2.92 mm.

Visit Booth 2335 to see Corning’s future-defining microwave connectivity solutions. For more information, visit corning.com/microwave.

Media Contacts
Emily Steves

(607) 438-9859
StevesEM@corning.com

Kitrick McCoy

(607) 454-8870
mccoyk@corning.com