DC-70 GHz Chip Scale Package Resistive Power Divider: MPDR-0070CSP2

Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances result in less unit-to-unit variation than traditional power divider technologies, allowing for accurate simulations using the provided S3P file taken from measured production units. The 2.5 x 2.5mm CSP2 package enables extreme miniaturization of SMT footprint while providing die-level performance making the MPDR-0070CSP2 ideal for applications prioritizing low SWaP.