Leveraging Thin Film On Ceramic Substrates For Interconnects And Interposers

Innovation in advanced packaging was driven, in part, by advancements in interposer design and construction. Interposers are electronic components designed to sit within a package and connect different circuits and components via interconnects. Thin film interconnects are standard in high-frequency components and subsystems where transmission line widths are small (i.e., .005” and under) to improve overall system performance. They also support high-power applications where thermal conductivity is more of a concern and certain materials like beryllium oxide and aluminum nitride are more commonly used. 

Ceramics-Based Interposer Design

Ceramics were one of the first materials used as substrates for mass-produced electronics, and they’re still used for packaging and interconnects today. Thin film on ceramics is ideal for surface interconnects with dense circuits. The ability to leverage the high reliability of ceramics while creating more complex, dense designs is particularly helpful in military applications and other applications where systems can’t quit. With a low dielectric constant and low loss tangent, which minimizes signal loss at high frequencies, thin film ceramic interposers are well-suited for RF and microwave applications.